Feature

●Release surface in fabrication of parts cured at elevated temperatures.
●Mask for protection of gold fingers of printed circuit boards during wave solder or solder dip process.
●Designed for high temperature applications such as wave soldering and protection for bar code labels which are subjected to high temperature.
●Country of origin: United States


Description

Film Tape, Number of Adhesive Sides 1, Tape Backing Material Polyimide, Tape Adhesive Silicone, Tape Thickness 2.7 mil, Tape Width 1 in, Tape Length 5 yd, Min. Tape Performance Temp. -100 Degrees F, Max. Tape Performance Temp. 500 Degrees F, Tape Tensile Strength 33 lb-in, Tape Adhesive Strength 22 oz/in, Tape Shape Continuous Roll, Series 5413, Standards RoHS Complaint/REACH Regulations 2002/95/EC and 2005/618/EC, ASTM D3330, D3759, D3652, D149, E-595