Feature

●Release surface in fabrication of parts cured at elevated temperatures.
●Mask for protection of gold fingers of printed circuit boards during wave solder or solder dip process.
●Designed for high temperature applications such as wave soldering and protection for bar code labels which are subjected to high temperature.
●Country of origin: United States


Description

3M Polyimide Film Tape 5413 with DuPont Kapton polyimide film and silicone adhesive used for PCB solder masking and other high temperature applications. Amber, 2.7 mil thick.