Feature

●Release surface in fabrication of parts cured at elevated temperatures.
●Mask for protection of gold fingers of printed circuit boards during wave solder or solder dip process.
●Designed for high temperature applications such as wave soldering and protection for bar code labels which are subjected to high temperature.
●Country of origin: United States


Description

Film Tape, Tape Backing Material Polyimide, Tape Adhesive Silicone, Tape Thickness 2.70 mil, Tape Width 1 In., Tape Length 36 yd., Tape Shape Continuous Roll, Min. Tape Performance Temp. -100 Degrees F, Max. Tape Performance Temp. 500 Degrees F, Tape Tensile Strength 33 lb./in., Tape Adhesive Strength 22 oz./in., Series 5413, Standards RoHS Complaint/REACH Regulations 2002/95/EC and 2005/618/EC, ASTM D3330, D3759, D3652, D149, E-595, Tapecase product manufactured from 3M material.