Feature

●Release surface in fabrication of parts cured at elevated temperatures.
●Mask for protection of gold fingers of printed circuit boards during wave solder or solder dip process.
●Designed for high temperature applications such as wave soldering and protection for bar code labels which are subjected to high temperature.


Description

Film Tape, Number of Adhesive Sides 1, Tape Backing Material Polyimide, Tape Adhesive Silicone, Tape Thickness 2.7 mil, Tape Width 2 in, Tape Length 5 yd, Min. Tape Performance Temp. -100 Degrees F, Max. Tape Performance Temp. 500 Degrees F, Tape Tensile Strength 33 lb-in, Tape Adhesive Strength 22 oz/in, Tape Shape Continuous Roll, Series 5413, Standards RoHS Complaint/REACH Regulations 2002/95/EC and 2005/618/EC, ASTM D3330, D3759, D3652, D149, E-595.