Feature

●Cooling Pads


Description

Cooling Pads
Feature:
These heatsinks have a layer of thermal adhesive and mount easily to your motherboard.
The profile of these heatsinks is short enough to fit into a standard case.
The thermal conductivity of pure copper heat sink is as high as 401w/mk, which is very suitable for processor, CPU and GPU cooling. It has been tested to be suitable for CPU/SoC, reducing the risk of hardware failure due to overheating.
These heat sinks include thermal tape that effectively transfers heat to the heat sink, providing additional cooling to the IC. Also, its easy to remove with a blade, so you can remove the heatsink without damaging the chip.
These heat sinks can be used with other devices to cool processors, regulators, and more.
Installation Notes:
-Make sure the chip module is of dirt and grease.
- Peel off the protective lining from the bottom of the radiator.
- Attach the heat sink to the corresponding chip module and press firmly.
A package includes:
1 piece - 14mm x 12mm x 5.5mm copper heat sink
2 pieces - 8.8mm x 8.8mm x 5mm aluminum heat sink