Feature

●MECHANIC Advanced Paste Flux Soldering for mobile phone motherboard Repair, electric Soldering Iron Welding Fluxes for phone circuit board repair.
●Its boiling point only slightly higher than the melting point of the solder, For mobile phones, PC cards and other sophisticated electronic chip-level help welding.
●High bond strength, PH value neutral, insulation is strong, welding surface smooth, is no corrosive for IC and PCB.
●Wipe the surface of the object before soldering, apply the paste flux to the solder joint, solder the tin to the solder joint with soldering iron.
●Specifications: Model: MECHANIC-UV80; Color: Yellow, Weight: 0.08kg; Viscosity: 0.2Pas; Granularity: 0.22um; Packing: Aluminum box.


Description

APPLICABLE: Advanced Paste Flux Soldering for phone motherboard Repair, Electric Soldering Iron Welding Fluxes for phone circuit board repair

DESIGN: Its boiling point only slightly higher than the melting point of the solder

BRAND: MECHANIC High synthetic BGA Solder Flux Paste BGA Soldering Tin Cream

MATERIAL: High bond strength, PH value neutral, insulation is strong, welding surface smooth

WHAT YOU GET: 80G Solder Flux Paste with aluminum box

BGA Solder Paste Tin

BGA Solder Paste TinBGA Solder Paste Tin

Advanced Paste FluxAdvanced Paste Flux

Advanced Paste FluxAdvanced Paste Flux

Advanced Paste FluxAdvanced Paste Flux

Rosin Soldering Flux Paste

Cleans and prevents oxidation

Rosin Soldering Flux Paste

Increases efficiency of the soldering process

Rosin Soldering Flux Paste

Allows solder to form strong, long lasting mechanical and electrical bonds

Rosin Soldering Flux Paste

Facilitates the flow of solder