Feature

●Narrow the Gap: Due to its low hardness and great compressibility properties, it works as a perfect gap filler, bridging uneven surfaces and gaps without any problems
●Application：CPU, Display card, Mainboard/mother board, Notebook, Power Supply
●Good Heat Dissipation：Perfect To Filled Contact Surfaces Gap, effectively improve the heat transfer efficiency, improve the heat transfer , and also serve as insulation, shock absorption and sealing Equal effect
●Technical Data: Size: 100mm*100mm*2.0mm, color: gray, Dielectric Breakdown Voltage: >5500 VAc, Dielectric Constant: 4.5MHz
●Safe and Easy to Use: Natural consistency, no need for adhesive coatings, easy to handle for novices


Description

TIF780Z use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.