Feature

●Widely used for cooling IC-processors, graphics cards, CPU-GPU and heat sinks in computers and consoles.
●Aim to fill the gaps between the heating and the cooling unit; increasing the contact area for better thermal conductivity.
●Thermal compound pastes is easy to use and can be easily and accurately distributed on your processor graphics card.
●Excellent thermal conductivity, long-term durability.
●Make your temperature drop, reduce the loudnesses of your and improve the comfort of use.


Description

Thermal Conductive Silicone Grease TF4 1.5g 9.5W/m-K Silicone Heatsink Performances Thermal Compound Pastes Thermal Conductive Silicone Grease for Notebook Computer
Features:
Aim to fill the gaps between the heating and the cooling unit; increasing the contact area for better thermal conductivity.
Make your temperature drop, reduce the loudnesses of your and improve the comfort of use.
Thermal compound pastes is easy to use and can be easily and accurately distributed on your processor graphics card.
Excellent thermal conductivity, long-term durability.
Widely used for cooling IC-processors, graphics cards, CPU-GPU and heat sinks in computers and consoles.

Specifications:
Material: Silicone Grease
Thermal Conductivity: 9.5W m-K

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