Feature

●Excellent thermal conductivity, long-term durability.
●Thermal compound pastes is easy to use and can be easily and accurately distributed on your processor or graphics card.
●Make your device temperature drop, reduce the loudnesses of your device and improve the comfort of use.
●Widely used for cooling IC-processors, graphics cards, CPU-GPU and heat sinks in computers and game consoles.
●Aim to fill the gaps between the heating and the cooling unit; increasing the contact area for better thermal conductivity.


Description

TF4 1.5g Thermal Grease Conductive Compound Pastes 9.5W/m-K Silicone Grease for CPU-GPU IC-processors Heatsink TF4 1.5g Thermal Grease 9.5W/m-K for Graphics Card CPU-GPU Heatsink
Features:
Aim to fill the gaps between the heating and the cooling unit; increasing the contact area for better thermal conductivity.
Make your device temperature drop, reduce the loudnesses of your device and improve the comfort of use.
Thermal compound pastes is easy to use and can be easily and accurately distributed on your processor or graphics card.
Excellent thermal conductivity, long-term durability.
Widely used for cooling IC-processors, graphics cards, CPU-GPU and heat sinks in computers and game consoles.

Specifications:
Material: Silicone Grease
Thermal Conductivity: 9.5W/m-K
Color: Gray
Thermal Impedance (℃-cm2/W): less than 0.0068
Specific-gravity(25℃): 2.7g/cm³
Applicable Temperature Range: -50℃ / 240℃
Content: 1.5g
Electrically Conductive:
Harmless: YES

Package Includes:
1x TF4 1.5g Thermal Grease

Note:
Please allow 0-1cm error due to manual measurement.
Please allow for slight color difference due to different display resolution.