This kit includes The Hydronaut thermal paste and the TG remove cleaner. With its excellent thermal conductivity, Hydronaut can also be used in the overclocking area, but it was specially developed for users with large heat sinks who are looking for a high-quality product with an attractive price / performance ratio for their water cooling system. Especially for overclocking Excellent thermal conductivity No curing High long-term stability Not electrically conductive The Hydronaut Paste offers optimal thermal conductivity for large-area heat transfer media, as can be found particularly in the water cooling area.The Hydronaut Paste offers optimal thermal conductivity for large-area heat transfer media, as can be found particularly in the water cooling area. The Hydronaut thermal paste has a silicone-free carrier structure. This has the advantage that it has a very low weight and a high degree of flexibility, which means that the heat-conducting paste can be applied very easily. TG Remove is an acetone based nano-cleaner for the best cleaning results of thermal paste. In addition TG Remove has a degreasing effect which helps preparing the surface for new application e. g. on CPUs. TG Remove was developed by Thermal Grizzly with the focus on removing thermal paste and residues in the most efficient way. The degreasing effect helps to prepare the surface for best liquid metal application Hydronaut Thermal Paste Specifications: Thermal conductivity: 11.8 W / mk Thermal resistance: 0.0076 K / W Electrical conductivity: * 0 pS / m Viscosity: 140-190 Pas Spec. Weight: 2.6g / cm3 Temperature: -200 ° C / +350 ° C Content: 7.8g TG Remove Specifications: Electrical Conductivity: 6,3·10?7 S*m?1 Typical Application: CPUs, GPUs, Model: TR-99034-99041