EFFECTIVE INSULATION: Sil e grease glue has excellent insulation and resistance to acid, water, oz and oxidation.It is suitable for all heatsinks without a fixed clip, and can be used for a wide range of applications.
STRONG ADHESION: GPU thermal paste has strong adhesion and helps to effectively disperse heat from the chipset to the heat sink.This thermal plaster features strong adhesion properties that allow it to attachment with most als and non- als, ensuring a reliable and long-lasting connection.
SIL E GREASE MATERIAl: Heatsink plaster is made of sil e grease material, which is viscous, has good fluidity, has thermal conductivity, and has a wide temperature range (?60 to 300 degrees Celsius).
WIDELY USED: LED thermal paste is suitable for MOSFET, LED, heat sink, north and south bridge, graphics card, chipset, heat dissipation part, heat dissipation, electrical appliances, instruments and other industries.
LIGHTWEIGHT AND PORTABLE: Thermal paste is small and portable, easy to store and carry, suitable for all heat sinks without fixed clips.This thermal conductive glue helps disperse heat effectively, LEDs, GPU chipsets, and other electronic components that require direct attachmenting.
Specification:
Item Type: Thermal Conductive Glue
Material: Sil e Grease
Thermal Conductivity: >0.67 W/M.K
Single Net Weight: Approx. 5g / 0.2oz
Viscosity: .5MPA
Package List:
0 x Thermal Conductive Glue
Note:
Do not use thermal conductive adhesive between CPU and heat sink