Feature

●Increased cooling efficiency by applying heat: CPU cooling grease is a key factor of thermal conductivity and the grease itself thermal resistance. Made by Shin-Etsu Chemical Industry, X23 series is applied after application and the solvent will volatilize and reduce the grease membrane and the gap between the CPU and the heat sink reduces the thermal resistance value, which can conduct heat of the CPU more efficiently
●Standard Grease OWL-SILG-7762: Using Shin-Etsu Chemical Industries X-23-7762, the most standard model in the X23 series. Thermal conductivity increases to 4W/m / K at initial value and 6.0 W/m / K after film film is filled. The thermal resistance value is 0.6 inch (15 mm2 / K/W), making it a high cost performance model that is perfect for those who use solvent diluted grease


Description

Shin-Etsu Chemical X23 Series Solvent Diluted High Performance CPU Cooling Grease

Increased cooling efficiency by applying heat



Product Specifications

Grease Model: X-23-7762

Thermal conductivity: 6.0W/mk

Viscosity: 180pa.S. (at 25℃)

Usable temperature range: -50 - 120 °C

Heat Resistance: 0.5 sq ft (15 m2), K/W

Weight: Approx. 0.06 oz (1.7 g).

Accessories: Spatula for application