Feature(may vary by option.)
●10 gram high performance thermal glue with strong adhesion.
●Thermal conductivity > 1.2w/mk
●Thermal Impedance: < 0.06
●Can be applied for cooling the interface of heatsink and LED, Mosfet transistor, IC Chips, etc
[4-pack]
Description
Properties
Color: white
Surface drying time: 2-8 min
Hardness (Shore A): 45-75
Tensile strength (MPa): 2.0
Elongation: 100%
Adhesion and tensile strength(MPa): 1.5-2.0
Thermal conductivity(W/m.k): > 0.975
Volume resistance(c-in/W): <2.0x10^15
Dielectric strength(KV/mm): 20
Dielectric constant: 3.0
Dielectric loss factor(60Hz): 0.003
Continuous use temp: 200℃
Content:
Silicone material: 30%
Thermal conductive material: 40%
Strengthen fillers: 20%
Crossing agent: 10%