high-quality non-curing thermally conductive compound for mid to high-end applications. Suitable for attaching heat sinks, CPU fans, GPU coolers, LED chips, or anything else that requires strong thermal conductivity.
High stability and reliability Thermal conductivity: >5.15W/(m·K)
Thermal resistance: <0.004℃-in²/W
Instantaneous temperature limit: -50 to 340 ℃ / -58 to 644 ℉ m
Long-Term operating temperature limit: -30 to 280 ℃ / -22 to 536 ℉
Density: >3.25g/cm³
Ingridience: Silicone Compounds 10 % Carbon Compounds 45 % Metal Oxide Compounds 45 %
Color: Gray
Odorless, Low oil content, Non-volatile, Non-corrosive, Non-toxic, Flame retardant, Not electrically conductive