Feature(may vary by option.)

●EXCELLENT THERMAL CONDUCTIVITY：Thermal conductivity 1.93 W/m-k. It ensures that the heat generated by the CPU or GPU is effectively dissipated.and subsequently excellent temperature reduction performance
●HIGH DURABILITY: Low thermal resistance can keep mushy for a long time. Wide operating temperature range, stable performance under -30℃-280℃ environment. High heat dissipation performance, high-cost performance. It will not compromise over time.
●EASY TO USE:Thermal paste has ideal consistency and is very easy to use even for beginners;it is also not electrically conductive : there is no risk of short-circuits and safe to use with all types of heatsinks
●SAFETY APPLICATION：The is metal-free and non-electrical conductive which eliminates any risks of causing short circuit, adding more protection to the CPU and VGA cards.Suitable for CPU radiator or chip. High-temperature resistance, low thermal resistance, and high conductivity can achieve excellent heat transfer. Suitable for CPU, VGA, chipset, and other PC components.

[100g]




[25g]




[50g]





Description

thermal pastethermal paste

Specially designed for overclocking

  • Specially developed to meet the demanding needs of the overclocking community. It exhibits excellent heat transfer performance and can fully exploit the capabilities of a high-performance cooling system.

  • In the nano-particulate structure, micronized aluminum and zinc oxide contained in the paste interpolate slight unevenness of the heat medium such as CPU and the heat sink, and realize excellent thermal conductivity.

  • The thermal pate special compound that drying does not proceed even at high temperature of 80 ° C is performed, and it does not cure for a long time and maintains stable characteristics. Also, there is no concern about shorts due to non-conductivity.

Feature

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  • Nano particle structure
  • Fine-grained aluminum and zinc oxide contained in the paste interpolate the slight unevenness of the heat medium such as CPU and the heat sink, achieving excellent thermal conductivity.

  • Stability
  • A special compound that does not dry at a high temperature of 80 ° C is used to maintain stable properties without curing for a long time.

  • Non-conductive
  • There is no concern about shorts due to non-conductivity.
THERMAL PADTHERMAL PAD

Easy to Apply

Mainly used in computer CPU GPU PS4 LED... Thermal.With an ideal consistency, the HY883 thermal paste is very easy to use, even for beginners. The possibilities for its application and the most effectively way to avoid voids between CPU and cooler we show you in the video.

Whats in the box

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