Feature

●Do Not Use Thermal Glue Between CPU Chip And Heat Sink, use it within 24 hours once opened.
●Thermal conductivity:> 1.2W/m-K
●Strength of connected buildings: 55 lb.
●Features: thermal properties, strong adhesion
●Application: apply to all heatsink no fixed clip thermal paste. Ideal for MOSFET Heatsinki VGA CARD Northbridge Southbridge Heatsink.


Description

Br> * Application: apply to all heatsinkf no fixed clip thermal paste. Idea for MOSFET Heatsink, VGA CARD Northbridge Southbridge Heatsink.
* Features: thermal properties, strong adhesion
* Melting capacity: 0 (200°C/392°F / 24Hours)
* Evaporation: 0.001% (200°C/392°F / 24Hours)
* Thermal conductivity:> 1.2W/m-K
* Thermal Impedance: <0.06
* Clotting time: 3min (25°C/77°F
* Strength of connected buildings: 25Kg/55Lb
* Insulation coefficient> 5.1
* Dissipation coefficient <0.005
* Temperature resistance: 200°C/392°F
* Net Weight: 10g

Do Not Use Thermal Glue Between CPU Chip And Heat Sink