Feature

●1U passive proprietary middle-air-channel CPU heat sink
●Intel xeon scalable processors
●socket LGA3647-0 narrow mounting mechanismSpecifications
●Category (Motherboard): X11 Purley Platform CPU Heat Sink
●Application: X11 Purley Platform Front CPU Heat Sink for 2U 4 Nodes Twin Pro Square and Big Twin


Description

This CPU heat sink is designed for Supermicro X11 generation 2U 4 Nodes TwinPro and BigTwin series servers equipped with Intel Xeon scalable processors. The heat sink has been fully tested and validated by Supermicro to ensure the best quality and cooling performance. - 1U Passive Proprietary Middle-Air-Channel CPU Heat Sink - Intel Xeon Scalable Processors - Socket LGA3647-0 Narrow Mounting Mechanism - Supermicro Certified MANUFACTURER: Supermicro SERVER FORM FACTOR: 1U Proprietary COOLING TYPE: Passive CPU CONFIGURATION: Dual Processor, Multi Processor SUPPORTED CPU SKU: Intel Xeon Scalable Processors SUPPORTED CPU SOCKET: FCLGA3647-0 (Narrow Mounting Mechanism) SUPPORTED CPU TDP: Up to 165 Watts ATTACHED COOLING FAN: No WARRANTY: 1 year **PRODUCT ENVIRONMENTAL COMPLIANCE: RoHS and REACH compliant