Minimum Bond Line Thickness: 1mm Glass Transition Temp, Tg: 50 C Substrates: Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards. Typical Applications: microwave EMI and RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, and circuitry and as a cold solder. Viscosity @ 25 C cps: Paste Silver coated ceramic , %: 50 to 75 Pot Life @ RT: 1 Hour Mix ratio, by weight: 100:5 / Resin:Hardener Shelf life: 1 Year 15 minutes: @ 100C 30 minutes: @ 60C 24 hours: @ Room temperature Volume Resistivity: <0.0015 Hardness, Shore D: 81 Compressive Strength, psi: 13,600 Shrinkage Linear, in / in: 0.004 Specific Gravity, 25C / 25C: 2.60 Tensile Strength, psi: 8,900 Compressive Strength, psi: 13,700 Thermal Conductivity, btu / hr / ft2 / F / in: 90 Thermal Expansion Coefficient, (cm / cm / C 10-5): 1.9 Heat Distortion, C: 165 Operating Temperature Range, C: -50 to +165 Silver-Bond 6 Low Cost, Low Volume Resistivity, Electrically Conductive Silver Epoxy Adhesive represents the newest technology since the introduction of electrically conductive silver compounds. This unique formulation is based on a silver coated ceramic that results in lower material costs without adversely sacrificing the properties obtained with a pure silver formulation. This concept opens the door to a wide range of applications previously prohibited by the much higher cost of conventional silver conductive.Silver-Bond 6 Low Cost, Low Volume Resistivity, Electrically Conductive Silver Epoxy Adhesive cures at room temperature or can be accelerated with mild heat to form a tenacious bond between similar and dissimilar substrates such as aluminum, copper, magnesium, steel, bronze nickel, ceramic, glass, phenolic, and G-10 epoxy glass boards.Silver-Bond 6 Low Cost, Low Volume Resistivity, Electrically Conductive Silver Epo