Feature

●Spec. Gravity 1.16 g/cc Mixed Viscosity 310cP At 25 °C Solids contents % 100 Pot Life 30 minutes
●Adhesive Bond Strength 2150 psi Lap shear 24 hrs At 25°C 2600 psi 1 hr At 65°C 3000 psi 4 hrs 65°C
●Vol Resistivity 6.00e+ 13ohm-cm Dielectric Constant 4.3 At 1000 Hz Dielectric Strength 410 kV/in
●Maximum Service Temperature, Air 266 °F Minimum Service Temperature, Air -76.0 °F
●Refractive Index 1.54 Cure Time 5 minutes At 100°C 2 minutes At 120°C 1 minute At 150° C


Description

AA-BOND F110 is a rigid, optically clear adhesive with a very low viscosity. AA-BOND F110 is room temperature system an excellent choice for thin bond-line assembly and repair applications of prisms, lenses and other optic components. And its high strength makes this epoxy ideal for structural applications. AA-BOND F110 exhibits excellent wetting and wicking capabilities which allows it to adhere strongly to glass, ceramics, metals and most rigid plastics. GENERAL PROPERTIES: Appearance Transparent, clear Cure Type Room temperature Benefits High strength Perfect insulative properties Good resistance to salt solutions, mild acids and Alkalis and many other chemicals Mix Ratio by weight 100:11 / Resin:Hardener Operating Temperature -60 to 130 °C Typical Applications Exhibits excellent wetting and wicking capabilities which allows it to adhere strongly to glass, ceramics, metals and most rigid plastics. UNCURED PROPERTIES: Viscosity at 25 °C 310 Thixotropic Index 1.0 Specific Gravity, mixed 1.16 Reactive solids contents, % 100 Pot Life 30 minutes CURE SCHEDULE: 5 minutes at 100°C 2 minutes at 120°C 1 minute at 150°C CURED PROPERTIES: Glass transition temperature (Tg), °C 90 Hardness, Shore D 83 Refractive Index 1.54 Lap shear strength, psi 2150 (alum to alum, 24 hrs at 25°C) 2600 (alum to alum, 1 hr at 65°C) 3000( alum to alum, 4 hrs at 65°C) Call (888) 522-6742 for more information.