Mix Ratio by weight: 100:100 / Resin:Hardener Glass Transition Temp, Tg: 50 C Minimum Bond Line Thickness: 1mm Substrates: Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards. Typical Applications: Electrical, conductive, rmi/efi shielding, circuitry, printed circuit board and electronics repair Viscosity @ 25 C cps: Paste Specific Gravity, mixed: 2.79 Reactive solids contents, %: 100 Pot Life: 1 Hour Shelf Life: 6 Months 15 minutes: @ 100C 45 minutes: @ 50C 24 hours: Room temperature Hardness, Shore D: 85 Shrinkage linear in/in: 0.0003 Lap shear strength, psi: 9400 Volume Resistivity ohm. cm: <0.0001 Thermal Expansion Coefficient, (cm / cm / C 10-5): 1.5 Thermal Conductivity, btu / hr / ft2 / F / in: 100 Tensile Strength, psi: 9,500 Compressive Strength, psi: 14,000 Heat Distortion, C: 170 Operating Temperature C: -50 to +170 Silver-Easy-Mix 07 Silver Conductive Epoxy Easy 1 to 1 Mix Ratio Adhesive System is an epoxy adhesive and coating formulation based on pure silver. This versatile silver formulation offers the maximum continuity of conductivity with an electrical resistivity value of less than 1x10-4 ohmcm.Silver-Easy-Mix 07 Silver Conductive Epoxy Easy 1 to 1 Mix Ratio Adhesive System is also characterized by a wide operating temperature range from 50 to +170C.Silver-Easy-Mix 07 Silver Conductive Epoxy Easy 1 to 1 Mix Ratio Adhesive System is recommended for electronic bonding and sealing applications that require both fine electrical and mechanical properties.For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).1) Carefully clean and dry all surfaces to be bonded.2) Apply Silver-Easy-Mix 07 Silver Conductive Epoxy Easy 1 to 1 Mix Ratio Adhesive System completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bo