Feature

●Spec. Gravity 1.2 g/cc Mixed Viscosity 25 °C, mPa?s (cP) Thixotropic
●Mechanical Properties Hardness, Shore D 70 Cure schedule 2 hours at 25°C at 30min at 65°C
●Volume Resistivity 5.00e+11 ohm-cm Dielectric Constant 4.8 Dielectric Strength 410kV/in
●Maximum Service Temperature, Air 230 °F Minimum Service Temperature, Air -76.0 °F
●Refractive Index 1.55 C


Description

PRODUCT DESCRIPTION AA-BOND 201 is an exceptional epoxy formulation recommended for lower temperature or wet industrial bonding applications where FAST CURING is required. It is versatile two-part epoxy system contains no solvents, mixes easily at room temperature, and is suitable for high performance structural bonding applications where the combination of very fast room temperature curing coupled with low shrinkage and excellent mechanical and electrical properties is needed. AA-BOND 201 develops strong, tough bonds to metals, plastics, glass and glass fabrics, hardboards and forestry products, ceramics, rubber, masonry materials, and other construction materials. It is an excellent electrical insulator, and provides superior resistance to vapors and gases, water, galvanic action, petroleum fuels, salt solutions, and many other organic and inorganic compounds. AA-BOND 201 develops significant properties 1 hour after mixing. However, an extended cure of 4-6 hours at 25°C is required for fully matured bonds. AA-BOND 201 develops a high exotherm. Use it immediately after mixing. The exothermic reaction begins within 2 minutes after initiating the mixing step, so have everything ready mixing. GENERAL PROPERTIES Appearance Slight haze/ slight straw Cure Type Room temperature Benefits Resistant to many organic/inorganics Strong bond strength Great electrical insulator Durable Mix Ratio by weight 100:100 / Resin: Hardener Substrates Metals, ceramics, glass, glass fabrics, wood leather and rigid plastics Operating Temperature -60 to 110 °C Typical Application(s) Anything requiring the unique properties this adhesive offers UNCURED PROPERTIES: Viscosity at 25 °C, mPa?s (cP) Thixotropic Solids Content 100% Specific Gravity, mixed 1.2 g/cc CURE SCHEDULE: 30 minutes at 65°C 2 hours at 25°C MISC PROPERTIES: Volume Resistivity 5.00e+11 ohm-cm Dielectric Constant 4.8 Dielectric Strength 410kV/in CTE, linear 33.3 ?in/in-°Fat RT Hardness, Shore D 70