Polyimide polymers film exhibits an excellent balance of physical, chemical, and electrical properties over a wide temperature range With silicone adhesive for easy release and leaves no residue after peel away High performance, reliability and durability, with a unique combination of electrical, thermal, chemical and mechanical properties Wide range of applications for masking circuit boards, soldering ,electrical insulation and splicing wires Specification: Substrate material: Polyimide polymers film Glue Type: Silicone Substrate material thickness: 0.025mm Thickness with adhesive: 0.05mm Adhesive strength: 4.5N/25MM Tensile Strength: 135N/25mm Elongation: 35 % Temperature Range:-73°C ? 260°C (-99°F - 500°F) Applications: Automotive sensor and manifolds Insulating circuit boards Etching Fiber Optics Cable High temperature powder coating Semiconductor manufacturing Wave soldering during circuit board assembly 3D Printing