Feature(may vary by option.)
●33m*0.55mm size makes the heat insulation adhesive tape suitable for BGA chip welding.
●300 high temperature in the short run, 250 high temperature for a long time.
●Adopting special adhesive with strong adhesive force to achieve no dirt left after peeling.
●High extensibility that higher than 35% and high peel strength up to 5N/25mm enable this heat adhesive tape to work for a very long time.
●High insulation ensures the safety.
[Width 20mm & 0.8in]
[30mm wide]
[50mm wide]
Description
Features:
300 high temperature in the short run, 250 high temperature for a long time. High extensibility that higher than 35% and high peel strength up to 5N/25mm enable this heat adhesive tape to work for a very long time. High insulation ensures the safety. Adopting special adhesive with strong adhesive force to achieve no dirt left after peeling. 33m*0.55mm size makes the heat insulation adhesive tape suitable for BGA chip welding.
Specification:
Product type: Heat Insulation Adhesive Tape
Thickness: approx. 0.06mm
Length: approx. 33m
Stretchability: 35%
Peel strength: 5N/25mm
Tensile force: 135N/25mm
Temperature resistant: Long time: 250; Short time: 300
Width: 20mm, 30mm, 50mm for your choice
Package size: approx. 9.5 * 9.5 * 2 cm/ 3.74 * 3.74 * 0.79 in
Package weight: 47g
Package List:
1 * Heat Insulation Adhesive Tape