Feature

●Used as release surface in fabrication of parts cured at elevated temperatures.
●Mask for printed circuit boards during wave solder or solder dip process.
●Gold tab protection during wave solder of printed circuit boards.
●Polyimide film does not soften at elevated temperatures, thus, the film provides an excellent release surface at elevated temperatures.
●3M Preferred Converter: TapeCase is a 3M Preferred Converter; 3M has partnered with TapeCase to make their products available in a larger assortment of sizes, so that customers can use the tape in a variety of applications.

Description

Film Tape, Tape Backing Material Polyimide, Tape Adhesive Silicone, Tape Thickness 2.70 mil, Tape Width 1/2 In., Tape Length 5 yd., Tape Shape Continuous Roll, Min. Tape Performance Temp. -100 Degrees F, Max. Tape Performance Temp. 500 Degrees F, Tape Tensile Strength 33 lb./in., Tape Adhesive Strength 20 oz./in., Series 5419, Standards RoHS Complaint/REACH Regulations 2002/95/EC and 2005/618/EC, ASTM D3330, D3759, D3652, D149, E-595, Tapecase product manufactured from 3M material