Feature(may vary by option.)

●Solder Paste Content: Alloy Tin 62.8% Pb 36.8%Ag0.4%, Solder Flux Content: 10.8%
●Lead-Containing Solder Paste - Medium Temperature Solder Paste With Flux, Melting Point: 183 ℃ (361F)
●Pushing-Type Design Smoother Flowing No Wasting During Welding
●Widely Used In Chip/BGA /SMD Circuit Board, Motors, Lighting, IC, TV and Other Household Appliances And Industrial Equipment, Sensors, Wires, Fuses, Phone, Metal Shells, Motors, Lighting, Connectors, ,SMT Maintenance
●Warning:This Product Contains Lead, A Substance Known To The State Of California To Cause Cancer Or Birth DE-Fects Or Other Reproductive Toxicity. For More Information, Go To WWW.P65WARNINGS.CA.GOV

[20g]




[30g]




[40g]





Description

Solder wireSolder wire

Product Specification：

Brand Name: Essmetuin
Model Number: SPA3684
Material: Tin\Lead\Silver
Product name: Solder Paste
Net Weight: 40g
Melting Point: 183°C(361°F)
Feature: High Thermal Conductivity And Conductivity. The Post Soldering Transparent Residues Are Non-Conductive, Non-Corrosive And Highly Insulated
Application: BGA /SMD Circuit Board, Motors, Lighting, IC, TV and Other Household Appliances And Industrial Equipment, Sensors, Wires, Fuses, Phone,Metal Shells, Motors, Lighting, Connectors, SMT Maintenance
Usages: Paste For Soldering

BGA Planting TinBGA Planting Tin

PCB RepairPCB Repair

IC ChipIC Chip

BGA Planting Tin

PCB Repair

IC Chip

SPASPA

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