Feature

●【Disposable】 NC-559-ASM is a no-clean flux paste, the residue is very light in color, has a very high SIR value, and a special low-residue type that has l residue after use and does not need to be cleaned.
●【Solder paste】 Syringe type flux is light yellow paste, odorl and non-irritating, and its main component is rosin synthetic resin.
●【Easy to use】 The BGA solder paste is a syringe design and comes with 10 pins. It has strong fluidity, good wettability, and no waste in soldering.
●【Application】 The solder paste is suitable for the rework of mobile phone PCB, BGA and PGA and other SMDs. The soldering speed is fast, and the surface insulation resistance value after the residue is cured is high. Therefore, it has little electrical interference to mobile phone and other products.
●【Note】 Please pay attention to avoid contact with water, acid and alkali, water solubility (%) 0.002. Adapt to 50-60℃ temperature.


Description

Specification:
Condition: Brand New
Item Type: Solder Paste
Material: Tin
Type: NC - 559 - ASM
Color: Light yellow paste
Suitable Range: for CSP and other ball grid array welding spot repair and repair
Features: Low residue, L smoke, strong fluidity, no need for cleaning type
Smell: Tastel and non-irritating
Volatility: 300
Main Ingredients: Rosin synthetic resin
Self-Ignition Point(° C) 387
Proportion: 1.05-1.08
Flash Point (℉) 168
Flash Point is 92 ° C
PH 6.5
Avoid contact with water, acid and base
Water Solubility (%) 0.002
Melting point (℃) 50
Extinguishing Materials: Dry powder and foam
Boiling point (℃) 300
Harmful Substances: No
Good wettability and easy to weld
Adapt to 50-60℃ temperature

Package List:
10 x Solder Paste
10 x Needle