Feature

●Compact and lightweight, easy to carry and use.
●Tool, With strong suction, fast and effective removal of tin solder, Vacuum.
●ANTI SKID HANDLE: Soft anti skid handle of solder vacuum pump, Removal, Replaced tips, economical and easy to operate and .
●PULL OUT DESIGN: Desolde Pumps inside Sp use pull out , make solder sucker suction strong.
●Widely Application Suitable for the main nce of computer motherboard, e phone motherboard and other parts, Sucker.


Description

1. Suitable for the maintenance of computer motherboard, mobile phone motherboard and other parts.
2. Designed to remove the solder from the circuit boards and more.
3. With strong suction, fast and effective removal of tin solder.
4. Help you complete the task quickly and safely.
5. Compact and lightweight, easy to carry and use.

Spec:
Features:
Suitable for the maintenance of computer motherboard, mobile phone motherboard and other parts.
Designed to remove the solder from the circuit boards and more.
With strong suction, fast and effective removal of tin solder.
Help you complete the task quickly and safely.
Compact and lightweight, easy to carry and use.
Specification:
Condition: Brand New
Material: ABS
Color: Gray
Weight: 79g (approx.)

Package List:
1 * Desoldering Pump