Feature

●[High temperature airflow resistance]: The principle of vacuum suction pen is a tool that uses atmospheric pressure difference to suck components, can withstand high temperature airflow of 500℃ for 60 seconds and can be used continuously.
●[Compact design]: easy to operate, anti-static, no pollution of product surface, fast moving and light weight.
●[Use]: Generally used in SMT and other industries for IC components sucking, using vacuum pen to suck components compared with using tweezers to suck components, can greatly avoid collision peripheral components.
●[Easy to suck]: vacuum suction pen sucking electronic parts and small products is particularly convenient, built-in small powerful vacuum pump, no need to connect any suction tube or power cord, convenient to use at any time.
●[Multi-size]: Vacuum wand is available in various sizes to fit different size chips.


Description

Specification:
Condition: 100% Brand New
Item Type: Vacuum Sucker Pen
Model: LP200
Color: Shown as Picture
Vacuum pen is available in straight and curved heads, it comes standard with three sizes of tips:
LN250: FACE SIZE 1/8" DIA. 3.2mm
LN260: FACE SIZE 1/4" DIA. 6.4mm
LN270: FACE SIZE 3/8" DIA. 9.5mm

Package List:
1 * Vacuum Suction Pen
3 * acuum Suction Pen Tips

Note:
1. Please allow slight error due to manual measurement. Thanks for your understanding.
2. Monitors are not calibrated same, item color displayed in photos may be showing slightly different from the real object. Please take the real one as standard.

Vacuum Suction Pen Use Method:
When in use, aim the suction disc of the vacuum suction pen at the middle of the BGA element, then suck the component and remove it. (In between the BGA, the surface of the component should be cleaned well, otherwise it will affect the suction of the vacuum suction pen)
1. First select the suction cup that corresponds to the size of the IC to be drawn and installed on the suction pen nozzle.
2. After the suction pen is installed, place the suction cup flat on the IC.
3. Press the button on the suction pen to remove air from the vacuum device inside the pen, then release the button pen to produce vacuum suction to lift the IC
4. Place the suction IC in the position to be placed and press the button to remove air from the vacuum device in the pen so that the IC will fall off the suction cup.