Feature

●Application: Suitable for PCB welding of various high demand materials, and rarely phenomenons of tin tombstone displacement
●Less Residue: Full and bright tin beads on tin, less residue, white and transparent, no fluorine and other extremely corrosive substances
●Easy to Use: This low -temperature welding paste can preserve good wetting and help the release of mold, and has resistance to cold, upsurge and dry environment.
●Application: Low -temperature flux paste is suitable for PCB welding of various high -demand materials, and there is very little phenomenon of tin tombstones.
●Easy to Use: This low temperature solder paste has good wetting, and is resistant to cold slump, hot slump and drying


Description

How to Use:
Usedirectly

Specification:
Item Type: LowTemperatureFluxPaste
Model: SFD-231
Composition: Sn42 Bi58
Granules: 25-45um (No.3 powder)
Weight: 45g/Pcs with Tube
Applicable: Mobile phone CPU IC, etc.
Melting Point: 138℃
Material: Tin

Package List:
1 x LowTemperatureFluxPaste