Feature
●Grade: Prime / CZ Virgin;
●Orientation: <100>;
●Type/Dopant: P/Boron; Resistivity: 1-50 Ω;
●Front Surface: Polished with Thermal Oxide Layer of 200 nm; Back Surface: Etched;
●TIR < 3 μm; TTV < 10 μm; BOW < 10 μm; Roughness < 0.5 nm.
[4 inches Qty: 25 pc]
Description
Prime/CZ Virgin Grade Silica Substrates
Prime/CZ Virgin Grade;
Orientation: <100>;
Resistivity: 1-50 Ω;
Type: P/Dopant: Boron;
TIR <3 μm, TTV <10 μm, BOW <10 μm, Roughness <0.5 nm;
Available in two formats:
5mm x 5mm diced chips in gel membrane box (25 single-sided polished chips per box)
or
Single-Side Polished Wafers
Sizes of the Wafers Available:
Six Inch 6 Wafer with a Thickness of 650 μm +/- 20 μm;
Four Inch 4 Wafer with a Thickness of 525 μm +/- 20 μm;
Three Inch 3 Wafer with a Thickness of 400 μm +/- 20 μm;
Two Inch 2 Wafer with a Thickness of 300 μm +/- 15 μm;
Gel membrane boxes or wafer carriers are included for every single purchase.
For more information, please visit us at https://www.alphananotechne.com/silicon-wafers
or send us your questions to info@alphananotechne.com
or ask questions directly on the "