General information
Type CPU / Microprocessor
market segment mobile
Family: Fits Phenom II Dual Core Mobile
Model: N660
CPU part number HMN660DCR23GM is an OEM/tray microprocessor
Step code AAEKC AE NAEKC AE
frequency? 3000 MHz
bus speed? One 1800 MHz 16-bit HyperTransport link (3.6 GT/s)
Clock Multiplier ? 15
Socket Socket S1 (S1g4)
Dimensions 1.38" x 1.38" / 3.5cm x 3.5cm
Weight 0.2oz / 5.6g (measured)
0.2oz / 6.5g (by size)
Architecture/Microarchitecture
Microarchitecture K10
platform danube
Champlain
processor core?
DA-C3
Core stepping ?
CPUID 100F63
Manufacturing process 0.045 micron silicon-on-insulator (SOI) technology
Data width 64 bits
Number of CPU cores 2
Number of threads 2
Floating point unit integrated, 128 bits wide
2 x 64 KB 2-way set associative instruction cache
L1 cache size? 2 x 64 KB 2-way set associative data cache
L2 cache size? 2 x 1 MB 16-way set-associative cache
Level 3 cache size without any
multiprocessing single processor
Extensions and technical MMX instructions
MMX extension
3D now! technology
An extension of 3DNow!
SSE / Streaming SIMD Extensions
SSE2 / Streaming SIMD Extensions 2
SSE3 / Streaming SIMD Extensions 3
Low power consumption features Power up !
Integrated peripherals/components
Integrated graphics without any
Memory Controller Number of Controllers: 1
Memory Channels: 2
Supported memory: DDR3-1333, DDR3L-1066
Maximum memory bandwidth (GB/s): 21.3
Other Peripherals HyperTransport Technology 3.0
Electrical/Thermal Parameters
Thermal design power ? 35 watts