General information
Type CPU / Microprocessor
market segment mobile
Family: Fits Phenom II Triple Core Mobile
Model: P840
CPU part number HMP840SGR32GM is an OEM/tray microprocessor
Stepper code NADHC ad
frequency? 1900 MHz
bus speed? One 1800 MHz 16-bit HyperTransport link (3.6 GT/s)
Clock Multiplier ? 9.5
Wrapped 638-pin capless organic micro-needle grid array (UOL638)
package number 30605
Socket Socket S1 (S1g4)
Dimensions 1.38" x 1.38" / 3.5cm x 3.5cm
Weight 0.2oz / 6.5g (by spec)
Presentation Dates September - October 2010
End of Life Date Last Order Date is Q3 2011
Last shipping date is Q1 2012
Architecture/Microarchitecture
Microarchitecture K10
platform danube
Champlain
processor core?
BL-C3
Core stepping ?
CPUID 100F53
Manufacturing process 0.045 micron silicon-on-insulator (SOI) technology
Data width 64 bits
Number of CPU cores 3
Number of threads 3
Floating point unit integrated, 128 bits wide
3 x 64 KB 2-way set associative instruction cache
L1 cache size? 3 x 64 KB 2-way set associative data cache
L2 cache size? 3 x 512 KB 16-way set-associative cache
Level 3 cache size without any
multiprocessing single processor
Extensions and technical MMX instructions
MMX extension
3D now! technology
An extension of 3DNow!
SSE / Streaming SIMD Extensions
SSE2 / Streaming SIMD Extensions 2
SSE3 / Streaming SIMD Extensions 3
Low power consumption features Power up !
Integrated peripherals/components
Integrated graphics without any
Memory Controller Number of Controllers: 1
Memory Channels: 2
Supported memory: DDR3-1066, DDR3L-1066
Maximum memory bandwidth (GB/s): 17.1
Other Peripherals HyperTransport Technology 3.0
Electrical/Thermal Parameters
Thermal design power ? 25 watts