[for Huawei 8 Pieces]

[for Qualcomm 7 Pieces]

[for IOS Phone 8 Pieces]

1. Accurate Positioning: Strong magnetic adsorption, fast tin planting, template will not change under high temperature, accurate positioning.
2. Premium Materials: Made of stainless steel, it is strong, durable, not easy to damage, and has a long service life.
3. Compact Portable: With fine workmanship, it has a compact appearance, it is portable and can be carried around.
4. Easy To Operate: Adopts magnetic sliding cover opening and closing design, which is convenient to operate and use.
5. Magnetic Automatic Clamping: Using a new type of magnetic power source positioning, magnetic automatic clamping, convenient and flexible, stable and reliable clamping, support for a variety of CPU positioning.

Specification:
Item Type: Phone Tin Planting Set
Tin Planting Mesh Material: Stainless Steel

How to Use:
1. Put the CPU motherboard into the tin plating platform
2. Put the tin planting mesh on the CPU middle layer motherboard into the tinning table
3. The CPU tinning platform will automatically absorb the steel mesh
4. Take a small amount of solder paste and apply it to a clean cloth (slightly absorb the moisture inside, which is more conducive to tin planting)
5. Fill the tin product and apply lightly
6. Evenly fill each hole with tin
7. After the solder paste is filled, wipe off the excess solder paste with a dust free cloth.
8. Use tweezers to gently press both sides of the steel mesh, do not press on the hollow position in the middle
9. Do not remove the tinned wire mesh immediately after the air is heated. Wait until it cools before removing it.

PackageList:
1 x Planting Table
8 x Steel Mesh
or8 x Steel Mesh
or7 x Steel Mesh