Feature

●Heated bed module ensures stable and prolonged operation with normal heat dissipation.Description: The printer hot bed high-power expansion module is designed to work efficiently for extended periods, thanks to its ability to dissipate heat effectively. This ensures the module operates reliably and without any issues caused by excessive heating.
●High-power load cooling expansion resolves current load problems caused by overheating of the bed.Description: With strong heat dissipation capabilities, this module effectively tackles the issue of excessive power load due to the heating bed high temperature. It provides a solution that enables smooth operation and prevents any potential damage caused by overloaded currents.
●Equipped with large heat sink, capable of handling currents up to 30A or higher.Description: Featuring a spacious heat sink, this expansion module can handle high-current loads of up to 30A or even more. This design ensures stable performance even in demanding applications, providing users with peace of mind.
●Directly compatible with Ramp
●4 and MKS series motherboards for hot bed output.Description: This module offers seamless integration with popular Ramp


Description

Introductions:

Introducing our innovative [NEW] High-Power Heated Bed Module for Cooling Expansion! This powerful and efficient module is designed specifically to address the need for effective high-current load cooling in bed modules

With the inclusion of our unique MOS, this solution ensures optimal cooling performance, overheating and ensuring consistent functionality

It is the perfect choice for expanding your bed module cooling capabilities, providing a reliable and efficient cooling solution

Upgrade your system today with our High-Power Heated Bed Module for Cooling Expansion!

Specifications:

1.Dimensions:(5.91×3.94×1.57)"/(15.00×10.00×4.00)cm(L×W×H)

2.Weight:1.94oz/55.000g

PackageList:

1 x Heated Bed Module

1 x Adapter cable