Mix Ratio by weight: 100:6 / Resin:Hardener Substrates: Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards. Operating Temperature: 50 to +170C Typical Applications: Electrical, conductive, rmi/efi shielding, circuitry, printed circuit board and electronics repair Viscosity @ 25 C cps: Paste Specific Gravity, mixed: 2.79 Reactive solids contents, %: 100 Pot Life: 3 Hours Shelf Life: 1 Year 2 minutes: @ 120C 5 minutes: @ 100C 24 hours: Room temperature Hardness, Shore D: 85 Shrinkage linear in/in: 0.003 Tensile Strength, psi: 9500 Volume Resistivity ohm. cm: <0.0001 Compressive Strength, psi: 14,000 Lap Shear Strength, PSI: 9400 Thermal Conductivity, btu / hr / ft2 / F / in: 100 Thermal Expansion Coefficient (cm / cm / C 10-5): 1.5 Heat Distortion, C: 95 Silver-Bond 2LP Silver Electrically Conductive, Room Temp Cure, Long Pot Life is an epoxy adhesive and coating formulation based on pure silver. This versatile silver formulation offers the maximum continuity of conductivity with an electrical resistivity value of less than 1x10-4 ohm-cm.Silver-Bond 2LP Silver Electrically Conductive, Room Temp Cure, Long Pot Life is also characterized by a wide operating temperature range from 50 to +170C.Silver-Bond 2LP Silver Electrically Conductive, Room Temp Cure, Long Pot Life is recommended for electronic bonding and sealing applications that require both fine electrical and mechanical properties.For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).1) Carefully clean and dry all surfaces to be bonded.2) Apply Silver-Bond 2LP Silver Electrically Conductive, Room Temp Cure, Long Pot Life completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.3) Some separ