Feature

●Wide Temperature Range: The liquid level sensor can be calibrated at 0 and full scale and can be used over a wide temperature range, ensuring a wide range of use.
●Internal Active Temperature Compensation: The liquid level sensor is capable of internal active temperature compensation, extremely low temperature drift coefficient, patented circuitry and graphic design to ensure a better use experience.
●Ceramic Base: The liquid level sensor has a high modulus of elasticity ceramic base, with excellent resistance to and wear, very durable and sturdy.
●Shock and Vibration Resistance: The liquid level sensor is resistant to shock and vibration, ensuring the of the liquid level sensor itself.
●Compact Size: The liquid level sensor has high sensitivity, high accuracy and high stability, and is compact and easy to package.


Description

Feature:
1. Wide Temperature Range: The liquid level sensor can be calibrated at 0 and full scale and can be used over a wide temperature range, ensuring a wide range of use.
2. Internal Active Temperature Compensation: The liquid level sensor is capable of internal active temperature compensation, extremely low temperature drift coefficient, patented circuitry and graphic design to ensure a better use experience.
3. Ceramic Base: The liquid level sensor has a high modulus of elasticity ceramic base, with excellent resistance to and wear, very durable and sturdy.
4. Shock and Vibration Resistance: The liquid level sensor is resistant to shock and vibration, ensuring the of the liquid level sensor itself.
5. Compact Size: The liquid level sensor has high sensitivity, high accuracy and high stability, and is compact and easy to package.


Specification:







Item Type: Liquid Level Sensor
Model: CJ-18
Working Voltage: 2 to 20v
Sensitivity: 2 to 4mv/v
Operating Temperature Range: -40℃ to 125℃
Response Time: <1ms
Overload (allowable over pressure): 2.5 times the rated range
Service Life: More than 2 million range pressure cycles












Package List:
1 x Liquid Level Sensor

Note:
In addition to device drift, temperature induced changes are influenced by factors such as mounting stress relief, so it is recommended that stress relief and other processes be performed first.