Feature●Low-melt is applied at 265° F. to bond heat sensitive substrates such as polystyrene foam.●Excellent "hot-tack" when dispensed at low-melt temperatures.●Can bond expanded polystyrene, corrugated packaging and displays.●25 second bonding range. FDA listed.●3M Stock # 7100025246, Series 3762LMQDescription
8" - 3M 3762LMQ Low-Melt Glue Sticks. Low-melt is applied at 265° F. to bond heat sensitive substrates such as polystyrene foam. Excellent "hot-tack" when dispensed at low-melt temperatures. Can bond expanded polystyrene, corrugated packaging and displays. 25 second bonding range. FDA listed.