Feature

●Low-melt is applied at 265° F. to bond heat sensitive substrates such as polystyrene foam.
●Excellent "hot-tack" when dispensed at low-melt temperatures.
●Can bond expanded polystyrene, corrugated packaging and displays.
●25 second bonding range. FDA listed.
●3M Stock # 7100025246, Series 3762LMQ


Description

8" - 3M 3762LMQ Low-Melt Glue Sticks. Low-melt is applied at 265° F. to bond heat sensitive substrates such as polystyrene foam. Excellent "hot-tack" when dispensed at low-melt temperatures. Can bond expanded polystyrene, corrugated packaging and displays. 25 second bonding range. FDA listed.