Feature
●1. Optical communication devices (bonding of various glass packaging structures such as PLC splitter, CWDM, array grating waveguide AWG, etc.)
●2. Small speaker device bonding, semiconductor chip packaging, sensor production, hard disk head bonding, mobile phone component assembly.
●3. Bonding of small optical lenses (microscopes, infrared instruments, telescopes, night vision devices)
●4. PCB board (capacitors, inductors, chips), circuit board protective coatings, and fixed coils.
●5. Scientific research institutions: semiconductors, communication laboratories, medical polymer materials, photocatalysis and other applications.
[405nm]
Description
[395 light intensity]: 7000mW/cm² 365 light intensity: 3000mW/cm²
[Best spot]: 5MM
[Illumination distance]: 10-30MM
[UV lamp beads]: LG imported chips
[Input voltage]: AC90V-240V
[Power cord length]: 1.8M
[Light source life]: 10000 hours
Wide application range: 1. Optical communication devices (bonding of various glass packaging structures such as PLC splitter, CWDM, array grating waveguide AWG, etc.)
2. Small speaker device bonding, semiconductor chip packaging, sensor production, hard disk head bonding, mobile phone component assembly.
3. Bonding of small optical lenses (microscopes, infrared instruments, telescopes, night vision devices)
4. PCB board (capacitors, inductors, chips), circuit board protective coatings, and fixed coils.
5. Scientific research institutions: semiconductors, communication laboratories, medical polymer materials, photocatalysis and other applications.