Feature

●Designed to withstand multiple cycles of harsh condition washes for printed circuit boards
●Constructed with a static dissipative adhesive  This product has adhesive surface resistivity values in the recommended range for dissipative ESD packaging materials as defined by ANSI/ESD S541-2008 (between 104 and 1011 ohms)
●Preheat can be employed to further enhance print permanence in the case of extreme solvent and/or abrasion exposure
●Made in United States


Description

Labels for the BMP71 Label Printer. Please Note: This material is UL recognized with its respective ribbon. See the "Recommended Ribbon Series" for the appropriate ribbon to use.