Feature
●Aluminum Material: The aluminum heatsink is made of high-quality metal aluminum material, which has good thermal conductivity, can ensure maximum strength and durability, can be used for a long time
●Large Area Heat Dissipation: The design of the largest surface area can ensure contact with cooling air, greatly increases the heat dissipation area, cools to a low temperature to avoid overheating and throttling, and improves computer performance
●Simple Installation and Reduce Risk: The aluminum chipset heatsink is quick to install and can be directly fixed on the product that needs heat dissipation, which will improve your work efficiency and reduce the risk of hardware failure due to overheating, better for your electronic devices
●Compact Size: The cooling fin is lightweight and perfectly sized with dimensions of 12.5 x 7 x 5cm / 4.9" x 2.8" x 2"(L*W*H), which is designed for tight spaces, please make sure the heatsink is the right size for your components
●Wide Application: Widely used for solid state relay SSR, computer, power transistor, FET, IC, power amplifier, power electric device, etc..
Description
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Dimension |
Large Area Heat Dissipation |
Compact Size |
