AA-BOND 2153 is a thixotropic (smooth paste) thermal conductive epoxy system that passes the NASA Outgassing Specification. It is used for staking transistors, diodes, resistors, integrated circuits and other heat sensitive components to printed circuit boards. AA-BOND 2153 is two parts adhesive develops strong, durable, high impact bonds at room temperature which improve heat transfer while maintaining electrical insulation. AA-BOND 2153 bonds to itself and to metals, silica, alumina, others ceramics, glass, plastics and many other materials. AA-BOND 2153 provides excellent resistance to salt solutions, mild acids and alkalis, and many other chemicals. GENERAL PROPERTIES Appearance Dark grey Cure Type Room temperature or Heat Cure Benefits Strong Durable High impact bonds at room temperature Mix Ratio by weight 100:7 Resin:Hardener Operating Temperature -40 to 125 °C Typical Applications Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards UNCURED PROPERTIES: Specific Gravity, mixed 2.44 Reactive solids contents, % 100 Pot Life 30 minutes CURE SCHEDULE: 1-3 hours at 65°C 24 hours at 25°C CURED PROPERTIES: Glass transition temperature (Tg), °C 110 Hardness, Shore D 88 Dielectric strength, volts/mil 410