AA-BOND FS291 is a thixotropic room temperature cure epoxy adhesive system developed for structural bonding applications on vertical or overhead surfaces where its no-sag characteristics are critical. AA-BOND FS291 is medium exotherming system exhibits excellent flow and wetting characteristics. GENERAL PROPERTIES Cure Type Heat cure or Room temperature Benefits Excellent flow Excellent wetting characteristics Works on a wide variety of substrates Mix Ratio by weight 100:81 / Resin:Hardener Substrates Glass, most metals, and variety of plastics Typical Applications Structural bonding, overhead and vertical applications Pot Life 45 minutes CURE SCHEDULE: 1 hour At 65°C 24 hours At 25°C MISC PROPERTIES: Volume Resistivity 2.70e+13 ohm-cm Hardness, Shore D 78 Lap shear 3300 psi (Alum to Alum) GENERAL INFORMATION: For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS). AVAILABILITY: This epoxy can be supplied in various different packages