Gold filled epoxy allows for anti-oxidation of contacts and terminals in high reliability devices found in aerospace, military, and avionics industry. It has also been used in medical circuits using traditional hybrid packaging technologies. High viscosity paste allows for precision deposition onto circuits by means of printing and delicate hand processes. Low temperature cure capabilities with an extended pot life. Suggested applications: Adhesive for joining die and SMDs onto the hybrid circuits. Repairing defective Au thick-film conductor traces and contact pads. Resisting oxidation and electro-migration in high-reliability micro-electronics. Easy mix pre-measured pouch. Simple mix and use without any mess.