Feature

●Spec. Gravity 1.12 g/cc Mixed Viscosity 650 At 65° C cP Pot Life 75 minutes Appearance Amber
●Mechanical Properties Hardness, Shore D 75 Adhesive Bond Strength 2500 psi Lap shear 1 hr At 100°C
●Volume Resistivity 1.20e+14 ohm-cm Dielectric Constant 3.35 At 1000 Hz Dielectric Strength 460 kV/in
●Max Service Temp Air 230 °F Min Service Temp Air -76°F CTE linear 35.6 μin/in-°F At Temp 68 °F
●Cure Time 4 hours At 65°C 24.0 hour At 25°C Cure Type Heat cure or Room temperature


Description

AA-BOND FS227 is a thixotropic polymer epoxy/polyamide system developed for industrial adhesive and sealing applications where the combination of high fill, easy handling, good wetting, toughness, and superior mechanical properties are required. GENERAL PROPERTIES Appearance Amber Cure Type Heat cure or Room temperature Benefits High fill Easy handling Good wetting Toughness High temp Fast cure Low viscosity Operating Temperature -60 to 110 °C Substrates Most material surfaces, including many metals, rigid plastics, glass, ceramics, leather, rubber, wood and concrete UNCURED PROPERTIES: Viscosity At 25 °C 650 Specific Gravity, mixed 1.12 g/cc Pot Life 75 minutes CURE SCHEDULE: 4 hours At 65°C 24 hours At 25°C CURED PROPERTIES: Volume Resistivity 1.20e+14 ohm-cm Dielectric Constant 3.35 At Frequency 1000 Hz Glass Transition Temp, Tg 3.35 At Frequency 1000 Hz Dielectric Constant 70 °C Hardness, Shore D 75 Lap shear 2500 psi (Alum to Alum) GENERAL INFORMATION: For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS). AVAILABILITY: This epoxy can be supplied in various different packages.