Feature

●Hot melt adhesive ideal for potting of electrical and electronic components
●Low viscosity provides high flow rates for excellent coverage
●Ball and ring tested ? adhesive exhibits good temperature resistance after application
●30 second bead open time makes for effective potting at depth
●For use with 3M Hot Melt Applicator PG II, allowing for fast-paced production


Description

Our 3M Hot Melt Adhesive 3797 is a temperature resistant, low viscosity adhesive which flows easily into small areas for effective coverage and protection, ideal for electrical potting. This 100% solids thermoplastic adhesive also provides a quick 30-second open bead time for potting even at depth. It is best used with our 3M Hot Melt Applicator PG II ? excellent for high volume operations.