Feature

●??【EXCELLENT THERMAL CONDUCTIVITY】:Upgraded thermal silica gel material with 12.8 W/mK thermal conductivity, Density (G/cc): 3.1±0.2 Hardness (Sc): 30~55; Breakdowm voltage: 9.8KV; Conductivity: None,our thermal pad greatly improve the heat transfer between the electronic elements and effectively cool the temperature down in seconds.
●?【SUPER RELIABLE & DURABLE】:High temperature performance in -40 ℃ - 200 ℃ will not melt, non-toxic, odorless, anti-corrosion, wear resistant, anti-static, fire retardant, compression, good insulation, contact with any electrical traces wouldn’t result in damage of any sort.
●??【EASY & CONVENIENT TO USE】:Dimension 120x120x2mm, the thermal pads can be cut freely according to your needs, perfect to filled contact surfaces gap, a great assistant for both beginners and professionals.
●?【WIDELY APPLICATION】:Perfectly replaces traditional heatsink compound grease paste, great for PC,Control board, motor, electronics, CPU, GPU, Heat Sink, Power LED,PS4, auto mechanics, computer host, laptop,solid-state drives,Gaming equipment, DVD, VCD, LID, Set-top box, LED IC SMD DIP and any cooling modules.
●??【NO RISK PURCHASE】 :We committed to provide superior thermal pads, easy to install, feel free to contact us if there is any issue with our thermal pads.

[1.5mm]




[2.0mm]




[2.5mm]





Description

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Thermal Pad 12.8 W/mK, High-Temperature Resistance & Non-Conductive Heat Resistance

Key Features:

  • Excellent thermal conductivity: Thermal pad can fill the gap between the heating element and the Heatsink with extremely high thermal conductivity (12.8 W/m.K) and reduce the heat source surface and the heat dissipation device contact surface between the contact thermal resistance. Thermal conductivity of silicone Pad can also be good filling the gap.
  • Super reliable safe application: Non-toxic, odorless, anti-corrosion, wear resistant, anti-static, fire retardant, compression, good insulation, contact with any electrical traces wouldn’t result in damage of any sort
  • Unique properties: balance thermal resistance and viscosity, and improve thermal conductivity of contact surfaces
  • Easy to install: easily cut with different sizes to align with practical real cooling scenario.
  • Dimension of Thermal Pad is 120mm X 120mm
  • Available thicknesses are 0.5mm, 1.0mm, 1.5mm, 2.0mm, 2.5mm and 3.0mm

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Wide Application:

  • Computer hosts ,CPU, GPU, USICS, RDRAMTM, CD-ROM, IGPT module, hard disk drive, notebook computer
  • Electronic products, motherboard,Gaming equipment,motor,graphics cards, external pad and foot pad
  • Electrical appliances, high-power LED lighting, automotive machinery,communication equipment
  • Power equipment, automotive electronic modules (engine scrubber) power modules, high-power power supplies
  • Any other electronic equipment that needs to be filled with heat dissipation

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Installation Instructions of Thermal Pad:

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step 1

  • Wipe the surface of the cpu
  • Remove rust,dust and oil
  • Keep the contact surface with the thermal pad clean

step 2

  • Tear off the film on the back of the thermal pad
  • Place it flat on the chip

step 3

  • Gently peel off the film
  • Dont touch the surface

step 4

  • Install the radiator
  • Give the radiator a certain downward pressure
  • Avoid air bubbles, which will affect the thermal conductivity of the product
thermal pad 120 20 thermal pad thermal pad 2280 22110 heatsink thermal paste
Thermal Pad 120×20 Thermal Pad 85×45 Thermal Pad 120×120 M.2 2280 heatsink M.2 22110 heatsink Thermal paste TF8
Size 120mm X 20mm 85mm X 45mm 120mm X 120mm 75mmx22.7mmx11.7mm 103mmx22.7mmx11.7mm 116mm×189mm×17mm
Thermal conductivity (W/mk) 12.8 W/mk 12.8 W/mk 12.8 W/mk Cooling effect of 10 ℃-20 ℃ Cooling effect of 10 ℃-20 ℃ 13.8W/m.k
Non-conductive ? ? ? ? ? ?
Color Grey Grey Grey Grey Grey Grey

Whats in the box

  • Thermal pad