●??【EXCELLENT THERMAL CONDUCTIVITY】:Upgraded thermal silica gel material with 12.8 W/mK thermal conductivity, Density (G/cc): 3.1±0.2 Hardness (Sc): 30~55; Breakdowm voltage: 9.8KV; Conductivity: None,our thermal pad greatly improve the heat transfer between the electronic elements and effectively cool the temperature down in seconds. ●?【SUPER RELIABLE & DURABLE 】:High temperature performance in -40 ℃ - 200 ℃ will not melt, non-toxic, odorless, anti-corrosion, wear resistant, anti-static, fire retardant, compression, good insulation, contact with any electrical traces wouldn’t result in damage of any sort. ●??【EASY & CONVENIENT TO USE 】:Dimension 85x45x1.5mm, the thermal pads can be cut freely according to your needs, perfect to filled contact surfaces gap, a great assistant for both beginners and professionals. ●?【WIDELY APPLICATION】:Perfectly replaces traditional heatsink compound grease paste, great for PC,Control board, motor, electronics, CPU, GPU, Heat Sink, Power LED,PS4, auto mechanics, computer host, laptop,solid-state drives,Gaming equipment, DVD, VCD, LID, Set-top box, LED IC SMD DIP and any cooling modules. ●??【NO RISK PURCHASE 】:We committed to provide superior thermal pads, easy to install, feel free to contact us if there is any issue with our thermal pads.
Excellent thermal conductivity: Thermal pad can fill the gap between the heating element and the Heatsink with extremely high thermal conductivity (12.8 W/m.K) and reduce the heat source surface and the heat dissipation device contact surface between the contact thermal resistance. Thermal conductivity of silicone Pad can also be good filling the gap.
Super reliable safe application: Non-toxic, odorless, anti-corrosion, wear resistant, anti-static, fire retardant, compression, good insulation, contact with any electrical traces wouldn’t result in damage of any sort
Unique properties: balance thermal resistance and viscosity, and improve thermal conductivity of contact surfaces
Easy to install: easily cut with different sizes to align with practical real cooling scenario.
Dimension of Thermal Pad is 85mm X 45mm
Available thicknesses are 0.5mm, 1.0mm, 1.5mm, 2.0mm, 2.5mm and 3.0mm
Wide Compatibility:
Computer hosts ,CPU, GPU, PS5, PS4, SSD, VRAM, USICS, RDRAMTM, CD-ROM, IGPT module, hard disk drive, notebook computer
Electronic products, motherboard, graphics cards, gaming equipment, motor, external pad and foot pad
Electrical appliances, high-power LED lighting, automotive machinery, communication equipment
Power equipment, automotive electronic modules (engine scrubber) power modules, high-power power supplies
Any other electronic equipment that needs to be filled with heat dissipation