Thermal Grizzly Minus Pad is a thermal pad made of modified silicone. The silicone is filled with metal oxides, ensuring remarkable thermal conductivity. Best suited for electrical components such as PCs, notebooks, LED or LCD devices, semiconductors or transformers. It is also used for RAM, CPUs or GPUs. In general, it can be used for any component that uses a metal housing as a heat sink. The Thermal Grizzly Minus Pad 8 is currently available in the following sizes: 100 mm x 100 mm, 120 mm x 20 mm and 30 mm x 30 mm and a thickness between 0.5 and 2 mm.
Technical stuff:
The Thermal Grizzly Minus Pad has a thermal conductivity of 8.0 W/mk and a temperature range of -100 °C to +250 °C. It is perfect for configurations that support extremely demanding applications. Simultaneously protects the contact surfaces and prevents the formation of microcracks.
Applications:
The Thermal Grizzly Minus Pad 8 is best suited for electrical components such as PCs, notebooks, LED or LCD devices, semiconductors or transformers. For OC in particular, it is also used for CPUs, memory modules, GPUs, graphics card memories or motherboard chipsets. In general, it can be used for any component that uses a metal case as a heat sink.