Feature

●Good thermal conductivity: super carbon nano-grade super thermal conductivity silicone grease, thermal conductivity of 6.5 W/m-k; each package is equipped with 1 spatula, 2 finger cots and 1 cleaning wipe. Make it very convenient for you to use
●Non-conductive; insulation performance; withstand voltage above 10,000 volts; low thermal resistance, long-lasting paste state; Wide operating temperature range, stable performance under -30℃-280℃ environment;
●Various size packaging specifications: HY883 cpu thermal paste has 3 packaging specifications (4g 10g 20g), which can meet the needs of different groups of people.
●HY883 Thermal Compound Paste Product applications: notebook and desktop computers; high-power LEDs; network communication equipment, household appliances, electronic components, etc.
●HY883 thermal paste has high durability; it will not compromise over time. After you apply, you do not need to apply again because it will last for several years.

[20g]





Description

thermal pastethermal paste

Specially designed for overclocking

  • Specially developed to meet the demanding needs of the overclocking community. It exhibits excellent heat transfer performance and can fully exploit the capabilities of a high-performance cooling system.

  • In the nano-particulate structure, micronized aluminum and zinc oxide contained in the paste interpolate slight unevenness of the heat medium such as CPU and the heat sink, and realize excellent thermal conductivity.

  • The thermal pate special compound that drying does not proceed even at high temperature of 80 ° C is performed, and it does not cure for a long time and maintains stable characteristics. Also, there is no concern about shorts due to non-conductivity.