Feature●Made of high quality Aluminum, good thermal conductivity●Reduce the risk of hardware failure due to overheating●Maximize surface area Designed in contact with the cooling air. The 23pcs fins increase the area of the board and thus provide for greater heat transfer●Widely used for computer, Power Transistor, FET, IC, Power Amplifier, Voltage Regulator, MOSFET, SCR etc.●Please make sure that the size of the heat sink fits that of your componentDescription